Premium Thermal Compound Paste for CPU & Chipsets

Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)(Pack of 2)

Product details

Material : [2 pack]ISOL 6, Heat Sink Compound. Colour : Grey, Packing Type : Injection, Weight : Approx. 30 g
[2 pack]Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
[2 pack]It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
[2 pack]High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
[2 pack]Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently.

Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g)(Pack of 2)